C1020 is pure Copper with a Copper content of over 99.96%.
It is also also called ”Oxygen-Free Copper” (OFC) because it does not contain Copper Oxide (Cu2O) or residual deoxidant.
It has excellent electrical and thermal conductivity and does not cause Hydrogen embrittlement even when heated to high temperatures in a reducing atmosphere.
C1100 is pure Copper with a Copper content of over 99.90%.
It is refined Copper in which 0.02-0.05% Oxygen remains when electrolytic Copper is melted, also known as "Tough-Pitch Copper" (TPC).
Because of the high purity of Copper, it has an excellent conductor of electricity and heat as is C1020, but care must be taken to avoid hydrogen embrittlement when heated to high temperatures or welded in a reducing atmosphere due to the effect of Oxygen remaining in the material.
C1441, also known as "Tin bearing Copper", is a material with excellent electrical conductivity, thermal conductivity, heat resistance, and ductility.
It is used in leadframes for semiconductors and wiring devices.
C2600 is an alloy of Copper and Zinc in the ratio of 70:30 and is called "Brass".
It is stronger and cheaper than pure Copper, making it suitable for a variety of applications.
It has excellent ductility, drawability, and platability.
C2680 is an alloy of Copper and Zinc in the ratio of 65:35 and is called "Brass".
It is stronger and cheaper than pure Copper, making it suitable for a variety of applications.
It has excellent ductility, drawability, and platability.
Compared to C2600, C2680 has higher strength but lower elongation.